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林产化学与工业 ›› 2019, Vol. 39 ›› Issue (1): 123-128.doi: 10.3969/j.issn.0253-2417.2019.01.018

• 研究报告 • 上一篇    

马来海松酸环氧树脂在纸基覆铜板中的应用

孙熠昂(),宗传晖,王飞,张纳,李爱香   

  1. 山东理工大学 材料科学与工程学院,山东 淄博 255049
  • 收稿日期:2018-10-16 出版日期:2019-02-25 发布日期:2019-03-14
  • 作者简介:孙熠昂(1994—),男,山东淄博人,硕士生,主要从事高分子材料设计合成研究;E-mail:sunyiang@foxmail.com
  • 基金资助:
    国家自然科学基金资助项目(51303096)

Application of Maleopimaric Acid Epoxy Resin in Paper-based Copper Clad Laminate

Yi'ang SUN(),Chuanhui ZONG,Fei WANG,Na ZHANG,Aixiang LI   

  1. School of Materials Science and Engineering, Shandong University of Technology, Zibo 255049, China
  • Received:2018-10-16 Online:2019-02-25 Published:2019-03-14
  • Supported by:
    国家自然科学基金资助项目(51303096)

摘要:

以马来海松酸(MPA)为原料合成了马来海松酸环氧树脂(MPAER),并将MPAER替代E-51环氧树脂制备了纸基覆铜板,对MPAER和其固化物分别进行了FT-IR表征和TGA测试,研究了MPAER固化物的热性能和MPAER对覆铜板浸胶料凝胶化时间的影响,讨论了MPAER的替代量对覆铜板耐焊性、剥离强度、弯曲强度和燃烧性的影响。研究结果表明:MPAER固化物具有较好的热性能;当MPAER替代量小于60%时,凝胶化时间缩短;MPAER替代量为20%时,所制备覆铜板的综合性能最好,其剥离强度达到1.7 N/mm、耐焊性达到55 s、经/纬向弯曲强度分别达到362.9 N/mm2和317.7 N/mm2,均优于E-51环氧树脂覆铜板,且当MPAER替代量小于40%时,覆铜板的阻燃效果达到UL94V-0的最高阻燃级别。

关键词: 马来海松酸环氧树脂, 纸基覆铜板, 凝胶化时间, 综合性能

Abstract:

The maleopimaric acid epoxy resin(MPAER) was synthesized with maleopimaric acid(MPA) as the raw material, and the paper-based copper clad laminate(CCL) was prepared by replacing E-51 epoxy resin with the MPAER. The resin and its cured product were characterized by FT-IR and tested by TGA. The thermal properties of the cured resin and the effect of the resin on the gelation time of the copper clad laminate were investigated. The effects of the replacement amount of the resin on the soldering resistance, peel strength, bending strength and flammability of the copper clad laminate were discussed. The results showed that the cured product of maleopimaric acid epoxy resin had better thermal properties. When the replacement amount of the resin was less than 60%, the gelation time was shortened, and when it was more than 60%, the gelation time became long. When the replacement amount of the resin was 20%, the comprehensive performance of the prepared copper clad laminate was the best with the peel strength of 1.7 N/mm, the soldering resistance of 55 s, and the warp and weft bending strengths of 362.9 N/mm2 and 317.7 N/mm2, respectively, which were better than those of the copper clad laminates prepared by E-51 epoxy resin. When the replacement amount of the resin was less than 40%, the flammability of copper clad laminate reached the highest flame retardant level of UL94V-0.

Key words: maleopimaric acid epoxy resin, paper-based copper clad laminate, gelation time, comprehensive performance

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