Abstract:

The maleopimaric acid epoxy resin(MPAER) was synthesized with maleopimaric acid(MPA) as the raw material, and the paper-based copper clad laminate(CCL) was prepared by replacing E-51 epoxy resin with the MPAER. The resin and its cured product were characterized by FT-IR and tested by TGA. The thermal properties of the cured resin and the effect of the resin on the gelation time of the copper clad laminate were investigated. The effects of the replacement amount of the resin on the soldering resistance, peel strength, bending strength and flammability of the copper clad laminate were discussed. The results showed that the cured product of maleopimaric acid epoxy resin had better thermal properties. When the replacement amount of the resin was less than 60%, the gelation time was shortened, and when it was more than 60%, the gelation time became long. When the replacement amount of the resin was 20%, the comprehensive performance of the prepared copper clad laminate was the best with the peel strength of 1.7 N/mm, the soldering resistance of 55 s, and the warp and weft bending strengths of 362.9 N/mm² and 317.7 N/mm², respectively, which were better than those of the copper clad laminates prepared by E-51 epoxy resin. When the replacement amount of the resin was less than 40%, the flammability of copper clad laminate reached the highest flame retardant level of UL94V-0.

Key words: maleopimaric acid epoxy resin, paper-based copper clad laminate, gelation time, comprehensive performance