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Chemistry and Industry of Forest Products ›› 2020, Vol. 40 ›› Issue (3): 92-98.doi: 10.3969/j.issn.0253-2417.2020.03.012

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Preparation and Properties of Non-ionic Self-emulsified Waterborne Epoxy Curing Agents Derived from Tung Oil

Xiaohua YANG,Haiyang DING,Shouhai LI,Lina XU,Yamei LIN,Mei LI*()   

  1. Institute of Chemical Industry of Forest Products, CAF; National Engineering Lab. for Biomass Chemical Utilization; Key Lab. of Chemical Engineering of Forest Products, National Forestry and Grassland Administration; Key Lab. of Biomass Energy and Material, Jiangsu Province; Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, Nanjing 210042, China
  • Received:2020-03-09 Online:2020-06-28 Published:2020-06-29
  • Contact: Mei LI E-mail:meiyu20032001@126.com

Abstract:

The adduct of eleostearic acid methyl ester and maleic anhydride(TMA), was carried out the amidation reaction with triethylenetetra mine were performed to achieve polyamide curing agent derived from tung oil (TMAPA). Then, ring-opening addition of TMAPA with polyethylene glycol diglycidyl ether, followed by termination reaction between paraformaldehyde and primary amine, by which non-ionic waterborne epoxy curing agents derived from tung oil(TMAWCA) was obtained. The chemical structure of the intermediates and the targeted products were confirmed by Fourier transform infrared spectroscopy (FT-IR) and proton nuclear magnetic resonance (1H NMR). The result showed that the targeted products could emulsify hydrophobic liquid epoxy resin. It was found that the overall properties were best when the mass ratio of hydrophobic bisphenol F epoxy resin NPEF-170 and TMAWCA was 1.5:2 and the curing temperature was 25℃/4 h+60℃/4 h+80℃/2 h. The properties of the two-component film of NPEF-170/TMAWCA were as follows:adhesion level 1, flexibility 1 mm, pencil hardness H, impact resistance 50 kg/cm, water resistance>7 d, and water contact angle 85°.

Key words: adduct of eleostearic acid methyl ester and maleic anhydride, amidation reaction, non-ionic, waterborne epoxy curing agent, synthesis, performance

CLC Number: