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林产化学与工业 ›› 2011, Vol. 31 ›› Issue (4): 117-122.

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新型水基防腐剂在木材中的固着机理研究进展

于丽丽1, 高嘉1, 杨莹1, 曹金珍2, 马晓军1   

  1. 1. 天津科技大学 包装与印刷学院, 天津 300222;2. 北京林业大学 材料科学与技术学院, 北京 100083
  • 收稿日期:2010-10-21 修回日期:1900-01-01 出版日期:2011-08-30 发布日期:2011-08-30

Review on the Mechanisms of the New Water-borne Preservatives in Treated Wood

YU Li-li1, GAO Jia1, YANG Ying1, CAO Jin-zhen2, MA Xiao-jun1   

  1. 1. College of Packaging & Printing Engineering,Tianjin University of Science & Technology, Tianjin 300222, China;2. College of Material Science and Technology,Beijing Forestry University, Beijing 100083, China
  • Received:2010-10-21 Revised:1900-01-01 Online:2011-08-30 Published:2011-08-30

摘要: 对几种主要的水基木材防腐在木材中的固着机理进行了介绍。其中,在胺/氨铜防腐剂体系中,防腐剂中有效成分与木材实质间的反应主要为木质素及半纤维素中的羧基及羟基发生离子交换反应;在微化铜木材防腐剂体系(MCQ/MCA)中,防腐剂中有效成分通过高分子分散剂与木材纤维间较强的附着力固着在处理材中;而在硼类防腐剂体系中,防腐剂中有效成分的固着机理与铜比较相似,但硼酸盐无法直接固着在羧基及羟基中,因此有效成分的固着研究主要涉及以下两个方面:1)增加硼类防腐处理材的疏水性;2)与有机化学物质复合生成稳定的化合物固着在木材中。

关键词: 水基防腐剂, 固着机理, 氨/胺溶铜季铵盐(ACQ), 微化铜,

Abstract: The fixation mechanisms of the main water-borne preservatives in treated wood were reviewed. The fixation mechanism of copper-amine/ammonia based-wood preservative systems was ionic exchange reactions between the active ingredients in the preservative with the carboxyl groups and the hydroxyl groups in the wood lignin and hemicellulose. In the micro-copper wood preservative systems, the fixation mechanism is attributed to the stronger adhesive force between the higher molecular dispersing agent and cellulose. For the boron-based preservative system, the fixation mechanism is similar to the copper-based preservatives, but the borate could not be fixed in treated wood directly. Therefore the research of the active ingredient fixation in treated wood deals mainly about the following aspects: 1) improving the hydrophobic propertics of boron-based preservative-treated wood; 2) complexing with organic chemicals and generating stable compound fixed in treated wood.

Key words: water-borne preservatives, fixation mechanism, ammonia/amine copper quat (ACQ), micronized copper, boron

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